Packaging Engineer
AMD India Pvt Ltd
China, INDIA
3d ago
source : TimesJobs

78732 Packaging Engineer Location Suzhou, JiangSu, CN Company Advanced Micro Devices What you do at AMD changes everything At AMD, we push the boundaries of what is possible.

We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies building blocks for gaming, immersive platforms, and the data center.

Developing great technology takes more than talent it takes amazing people who understand collaboration, respect, and who will go the extra mile to achieve unthinkable results.

It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.

If you have this type of passion, we invite you to take a look at the opportunities available to come join our team. External Manufacturing Operations (Backend Engineering) THE ROLE Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip Assembly / Bumping manufacturer on delivering key performance indices in terms on yield, excursion free and enabling new capabilities.

THE PERSON The successful candidates must be a team player with a commitment to meeting deadlines / lead & drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment.

He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good presentation skills.

Good in writing and speaking in English. Last but not least, be able to cope with stress! KEY RESPONSIBILITIES Drive for supplier engagement on continuous improvement and new capabilities ahead of need.

Co-work with AMD internal stakeholders on new product development in external manufacturing facility of bumping and assembly.

Proactively communicate task assignments to responsible parties and ensure that tasks are completed within the planned time.

Proactively report project status to stakeholders. Plan and drive for New Product Introduction activities and Ramp Up readiness.

Drive external manufacturer on issue resolution and issue prevention Timely execution of special work requests, with comprehensive reports.

Monitor performance of external manufacturing site regarding yield, out of control lots disposition, and any outliers reporting from internal or external parties.

Plan and execute change management from internal or external parties. Proactively drive towards continuous improvement in process simplification and quality enhancement, be it in internal and external environment.

Provide disposition to out-of-control lots and present for Material Review Board (MRB). Occasionally to support on site audit and travelling.

May involve in regional vendor management. Assist in additional duties as deemed fit by supervisor. PREFERRED EXPERIENCE Strong knowledge in Flip chip Assembly process (while bumping process is added advantage) Track record of development work leading to volume production in Semiconductor Bumping / Assembly house.

Package stress simulation Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).

ACADEMIC CREDENTIALS Bachelor / MS degree in Mechanical or Material or Chemical Engineering LOCATION Suzhou APPLY Email to bella.

yu AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services.

AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law.

EOE / MFDV #LI-BY1 Requisition Number 78732 Country China State JiangSu City Suzhou Job Function Packaging Engineering

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